CH BCM.90
Symbol Micros:
CH BCM.90
Case : Rys.CH BCM.90
preparation for electroless copper tinning 90g produces a tight, shiny coating with very good adhesion and thickness 5-12um
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Write sales // micros.com.pl or call: +48 785 054 437
Write sales // micros.com.pl or call: +48 785 054 437
Parameters
| Product type C: | Copper tinning preparation |
| Capacity [g]: | 90g |
| Manufacturer: | AG Termopasty |
| Type of packaging: | Ziplock bag |
| Product type C: | Copper tinning preparation |
| Capacity [g]: | 90g |
| Manufacturer: | AG Termopasty |
| Type of packaging: | Ziplock bag |
Detailed description
Non-current Copper Plating Agent 90g
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A high-quality non-current (chemical) bath for printed circuit boards, producing tight, shiny coatings with very good adhesion and a thickness of 5-12 μm. Protects against the harmful effects of air and moisture.
Application:
- Protects against the harmful effects of air and moisture
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