Interflux solder IF-14 Sn60/Pb40
Symbol Micros:
CH CD.50-.50-2
Case : Rys.CH CD.50
Composition: Sn60%, Pb40%, flux: 1.4%, diameter 0,5mm, weight 500g. Melting temperature: 183 - 191°C
Parameters
Diameter: | 0,50mm |
Melting point: | 183°C~191°C |
Alloy composition: | Sn60Pb40 |
Mass: | 500g |
Manufacturer: | Interflux |
Diameter: | 0,50mm |
Melting point: | 183°C~191°C |
Alloy composition: | Sn60Pb40 |
Mass: | 500g |
Manufacturer: | Interflux |
Detailed description
The Interflux® IF 14 series consists of halogen-free, completely halide-free, no-clean solder wires with easily removable residues in SnPb (Ag) and lead-free alloys.
Residues can be washed off manually.
Composition: Sn60%, Pb40%,
flux: 1.4%,
diameter: 0.5mm,
weight: 500g.
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