Interflux solder IF-14 Sn96,5/Ag3/Cu0,5
Symbol Micros:
CH CD.70-.50CuAg
Case : Rys.CH CD.50CuAg
Composition: Sn96,5%, Ag3%, Cu0,5%, flux: 1.6%, diameter 0,7mm, weight 500g. Melting temperature: 217 - 219°C
Parameters
| Diameter: | 0,7mm |
| Melting point: | 217°C~219°C |
| Alloy composition: | Sn96,5Ag3Cu0,5 |
| Mass: | 500g |
| Manufacturer: | Interflux |
| Diameter: | 0,7mm |
| Melting point: | 217°C~219°C |
| Alloy composition: | Sn96,5Ag3Cu0,5 |
| Mass: | 500g |
| Manufacturer: | Interflux |
Detailed description
The Interflux® IF 14 series consists of halogen-free, completely halide-free, no-clean solder wires with easily removable residues in SnPb (Ag) and lead-free alloys.
Residues can be cleaned manually.
Composition: Sn96.5%, Ag3%, Cu0.5%,
Flux: 1.6%,
Diameter: 0.7mm,
Weight: 500g.
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