CH Diamond-4br
Symbol Micros:
CH Diamond-4br
Case : Rys.CH Diamond-4br
heat conductive paste based on Diamond powder 4g, thermal conductivity >4W/m2 Ideal for all processors, chipsets, GPU and other components
Any questions? We will be happy to answer.
Write sales // micros.com.pl or call: +48 785 054 437
Write sales // micros.com.pl or call: +48 785 054 437
Parameters
| Product type C: | Thermal paste |
| Capacity [g]: | 4g |
| Manufacturer: | AG Termopasty |
| Type of packaging: | Bottle |
| Type: | Paste |
| Product type C: | Thermal paste |
| Capacity [g]: | 4g |
| Manufacturer: | AG Termopasty |
| Type of packaging: | Bottle |
| Type: | Paste |
Detailed description
AG Diamond Brush Paste Based on Diamond Dust 4g
Ideal for all processors, chipsets, GPUs, and other components. It features excellent thermal conductivity parameters due to the use of diamond dust. The special brush facilitates easy application of the paste. Diamond dust content: 10%
PROPERTIES:
- Color: gray
Thermal conductivity: > 4 W/mk
Thermal impedance: < 0.065°C-in2/W
Specific gravity: > 2.4 g/cm3
Evaporation: < 0.001 %
Leakage: < 0.001 %
Dielectric constant: insulation
Viscosity: 1000
Thixotropic index: 380+/-10
Operating temperature: -40°C ~ 300°C
Thermal resistance: -40°C ~ 350°C
APPLICATION:
- Ideal for all processors, chipsets, GPUs, and other components.
Add Symbol
Cancel
All Contractor Symbols