CH Kl-term.10

Thermal Conductive Adhesive AG Termo Glue 10g

AG TermoGlue Thermal Conductive Adhesive is an excellent solution for attaching heat sinks, such as on memory chips, transistors, or bridges. The resulting connection is super-durable and provides excellent heat conductivity.

Properties:

Color: white
Surface drying time [25°C, h]: 30
Hardness: 45 - 75
Tensile strength (MPa): 2.0
Elongation (%): 100
Thermal conductivity (W/mK): > 1.0
Resistance (c-in/W): < 2.0 x 10¹⁵
Dielectric strength (KV/mm): 20
Dielectric constant: 3.0
Dielectric loss factor (60Hz): 0.003
Dielectric constant: > 5.1
Operating temperature (max): 200°C

Application:

Ideal for use with processors, chipsets, GPUs, and other components.