CH PaLEP-008ag
Symbol Micros:
CH PaLEP-008ag
Case : Rys.CH PaLEP-008ag
Solder paste for SMD komponents in the process does not include washing phase doesn't contain chlorides,flux residue doesn't corrode,doesn't require washing
Any questions? We will be happy to answer.
Write sales // micros.com.pl or call: +48 785 054 437
Write sales // micros.com.pl or call: +48 785 054 437
Parameters
| Capacity [ml]: | 1,4ml |
| Product type C: | Solder paste |
| Capacity [g]: | 8g |
| Manufacturer: | AG Termopasty |
| Type: | Paste |
| Type of packaging: | Can |
| Capacity [ml]: | 1,4ml |
| Product type C: | Solder paste |
| Capacity [g]: | 8g |
| Manufacturer: | AG Termopasty |
| Type: | Paste |
| Type of packaging: | Can |
Detailed description
Easy Print Sn62Pb36Ag2 (No Clean Type) 8g
No Clean flux paste intended for soldering SMD components in processes that do not involve washing phases.
The product, besides containing metal powders, includes flux based on resin and solvent, oxide-removing activators, and thixotropic additives responsible for viscosity and plasticity. The paste does not lose its physicochemical properties even after 20 hours of being left on the PCB board.
The duration depends on the conditions in the room, such as humidity and temperature.
Applications:
- electronics
- electrotechnics
- automatic soldering
- manual soldering
- SMD assembly
- automatic printing
- manual printing
Additional properties of the paste:
- contains no chlorides
- residual flux does not cause corrosion, no washing required
- soldered joints have good mechanical and electrical properties
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