CH PaLEP-008cu
Symbol Micros:
CH PaLEP-008cu
Case : Rys.CH PaLEP-008cu
Solder paste for SMD komponents in the process does not include washing phase contains a rosin-based flux, very good mechanical properties and electrical
Any questions? We will be happy to answer.
Write sales // micros.com.pl or call: +48 785 054 437
Write sales // micros.com.pl or call: +48 785 054 437
Parameters
Capacity [ml]: | 1,4ml |
Product type C: | Solder paste |
Capacity [g]: | 8g |
Manufacturer: | AG Termopasty |
Type: | Paste |
Type of packaging: | Syringe |
Capacity [ml]: | 1,4ml |
Product type C: | Solder paste |
Capacity [g]: | 8g |
Manufacturer: | AG Termopasty |
Type: | Paste |
Type of packaging: | Syringe |
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