CH PaLEP-008cu

Symbol Micros: CH PaLEP-008cu
Contractor Symbol:
Case : Rys.CH PaLEP-008cu
Solder paste for SMD komponents in the process does not include washing phase contains a rosin-based flux, very good mechanical properties and electrical
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Parameters
Capacity [ml]: 1,4ml
Product type C: Solder paste
Capacity [g]: 8g
Manufacturer: AG Termopasty
Type: Paste
Type of packaging: Syringe
Manufacturer:: AG TERMOPASTY Manufacturer part number: Easy Print Sn96,5Ag3Cu0.5 6g ART.AGT-028 Case style: Rys.CH PaLEP-008cu Datasheet
In stock:
10 pcs.
Quantity of pcs. 1+ 5+ 20+ 50+ 200+
Net price (EUR) 4,7449 4,0801 3,8194 3,7278 3,6503
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Packaging:
5
Capacity [ml]: 1,4ml
Product type C: Solder paste
Capacity [g]: 8g
Manufacturer: AG Termopasty
Type: Paste
Type of packaging: Syringe