CH PaLEP-020ag
Symbol Micros:
CH PaLEP-020ag
Case : Rys.CH PaLEP-020ag
Solder paste for SMD komponents in the process does not include washing phase doesn't contain chlorides,flux residue doesn't corrode,doesn't require washing
Parameters
| Capacity [g]: | 20g |
| Product type C: | Solder paste |
| Type: | Paste |
| Type of packaging: | Plastic container |
| Manufacturer: | AG Termopasty |
| Capacity [g]: | 20g |
| Product type C: | Solder paste |
| Type: | Paste |
| Type of packaging: | Plastic container |
| Manufacturer: | AG Termopasty |
Detailed description
Easy Print Sn62Pb36Ag2 (No Clean Type) 20g
No Clean flux paste intended for soldering SMD components in processes that do not involve washing phases.
The product, besides containing metal powder, includes flux based on resin and solvent, oxide-removing activators, and thixotropic additives responsible for viscosity and plasticity. The paste does not lose its physicochemical properties even after 20 hours of being left on the PCB board.
The duration depends on the room conditions: humidity and temperature.
Applications:
- electronics
- electrotechnics
- automatic soldering
- manual soldering
- SMD assembly
- automatic printing
- manual printing
Additional properties of the paste:
- contains no chlorides
- residual flux does not cause corrosion, no washing required
- soldered joints have good mechanical and electrical properties
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