CH PaLEP-250cu

Symbol Micros: CH PaLEP-250cu

57662

CH PaLEP-250cu

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Case : Rys.CH PaLEP-250cu

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Solder paste for SMD komponents in the process does not include washing phase contains a rosin-based flux, very good mechanical properties and electrical

Any questions? We will be happy to answer.
Write sales // micros.com.pl or call: +48 785 054 437

Parameters

Product type C:	Solder paste
Capacity [g]:	250g
Manufacturer:	AG Termopasty
Type:	Paste
Type of packaging:	Plastic container

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• Parameters

Product type C:	Solder paste
Capacity [g]:	250g
Manufacturer:	AG Termopasty
Type:	Paste
Type of packaging:	Plastic container

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