CH PaTermCu1.5
Symbol Micros:
CH PaTermCu1.5
Case : Rys.PATERMCU1.5
Heat conductive paste based on copper; 1.5cm3; Thermal conductivity ~3.1W/m2; For filling the connections processor - radiator to improve cooling;
Parameters
| Name: | Copper Thermal Grease |
| Product type C: | Thermal paste |
| Capacity [g]: | 0mg |
| Capacity [ml]: | 1,5ml |
| Manufacturer: | AG Termopasty |
| Type of packaging: | Syringe |
| Type: | Paste |
| Name: | Copper Thermal Grease |
| Product type C: | Thermal paste |
| Capacity [g]: | 0mg |
| Capacity [ml]: | 1,5ml |
| Manufacturer: | AG Termopasty |
| Type of packaging: | Syringe |
| Type: | Paste |
