CH PaTermCu40
Symbol Micros:
CH PaTermCu40
Case : Rys.PATERMCU40
Heat conductive paste based on copper; Used to fill the connections between processor and radiator to improve cooling; 40g; Thermal conductivity ~3.1W/m2;
Any questions? We will be happy to answer.
Write sales // micros.com.pl or call: +48 785 054 437
Write sales // micros.com.pl or call: +48 785 054 437
Parameters
| Name: | Copper Thermal Grease |
| Product type C: | Thermal paste |
| Capacity [g]: | 40g |
| Capacity [ml]: | 0ml |
| Manufacturer: | AG Termopasty |
| Type of packaging: | Syringe |
| Type: | Paste |
| Name: | Copper Thermal Grease |
| Product type C: | Thermal paste |
| Capacity [g]: | 40g |
| Capacity [ml]: | 0ml |
| Manufacturer: | AG Termopasty |
| Type of packaging: | Syringe |
| Type: | Paste |
Detailed description
Copper-based Thermal Grease, 40g
The copper-based thermal paste is designed for filling the processor to radiator connections in order to improve cooling. Thermal conductivity ~ 3.1 W/mK.
Applications:
- Filling processor to radiator connections
- Not suitable for aluminum radiators
- Does not conduct electricity
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