LA UMAL170X240X1.0-35
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| Laminate lenght: | 240mm |
| Laminate width: | 170mm |
| Laminate thickness: | 1mm |
| Cu thickness: | 35um |
| Type (Single/Double sided): | Unilateral |
| Manufacturer: | Cyfronika |
| Laminate lenght: | 240mm |
| Laminate width: | 170mm |
| Laminate thickness: | 1mm |
| Cu thickness: | 35um |
| Type (Single/Double sided): | Unilateral |
| Manufacturer: | Cyfronika |
LA UMAL170x240x1.0-35 Copper-Foiled Laminate on Aluminum Substrate 170x240x1.0mm with Cu Thickness 35um
| Material | Aluminum |
| Coating | Copper |
| Board Type | Single-Sided |
| Properties | Excellent Heat Dissipation |
| Application | High-Power Electronic Circuits |
Laminate for printed circuit boards, single-sided — Copper/AL used where quick and efficient heat dissipation is required from the designed circuit. The laminate consists of three layers: Copper foil (35um or 70um), an insulating layer (thin epoxy of around 0.1mm), and an aluminum plate about 0.9mm or 1.4mm thick. The aluminum plate acts as a heat radiator. The laminate is protected with adhesive foil on the aluminum side, resistant to etching processes. Thus, the process of manufacturing the printed circuit board essentially follows the standard laminate production technology. The protective foil on the aluminum side is removed at the end of the process.
Copper Layer Thickness: 35μm;