LA UMAL170X240X1.5-70
Write sales // micros.com.pl or call: +48 785 054 437
Laminate lenght: | 240mm |
Laminate width: | 170mm |
Laminate thickness: | 1,5mm |
Cu thickness: | 70um |
Type (Single/Double sided): | Unilateral |
Manufacturer: | Cyfronika |
Quantity of pcs. | 1+ | 2+ | 5+ | 10+ | 20+ |
---|---|---|---|---|---|
Net price (EUR) | 18,4014 | 16,5938 | 14,9335 | 14,0641 | 13,4323 |
Laminate lenght: | 240mm |
Laminate width: | 170mm |
Laminate thickness: | 1,5mm |
Cu thickness: | 70um |
Type (Single/Double sided): | Unilateral |
Manufacturer: | Cyfronika |
LA UMAL170x240x1.5-70 Copper-Foiled Laminate on Aluminum Substrate 170x240x1.5mm with Cu Thickness 70um
Material | Aluminum |
Board Coating | Copper |
Board Type | Single-Sided |
Properties | Excellent Heat Dissipation |
Application | High-Power Electronic Circuits |
This laminate for printed circuit boards, single-sided — Copper/AL, is used where quick and efficient heat dissipation from the designed circuit is required. The laminate consists of three layers: Copper foil (35um or 70um), an insulating layer (thin epoxy of about 0.1mm), and an aluminum plate with a thickness of around 0.9mm or 1.4mm. The aluminum plate thus acts as a heat radiator. The laminate is protected on the aluminum side with adhesive foil resistant to etching processes. Therefore, the process of producing the printed circuit board is essentially the same as that used in standard laminate PCB production. The protective foil is removed at the end of the processing.
Copper Layer Thickness: 70 μm;