LA UMAL255x305x1.5-70
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| Laminate lenght: | 305mm |
| Laminate width: | 255mm |
| Laminate thickness: | 1,5mm |
| Cu thickness: | 70um |
| Type (Single/Double sided): | Unilateral |
| Manufacturer: | Cyfronika |
| Quantity of pcs. | 1+ | 2+ | 5+ | 10+ | 20+ |
|---|---|---|---|---|---|
| Net price (EUR) | 30,5962 | 27,7549 | 25,1016 | 23,6927 | 22,6595 |
| Laminate lenght: | 305mm |
| Laminate width: | 255mm |
| Laminate thickness: | 1,5mm |
| Cu thickness: | 70um |
| Type (Single/Double sided): | Unilateral |
| Manufacturer: | Cyfronika |
LA UMAL255x305x1.5-70 Copper-Foiled Laminate on Aluminum Substrate 255x305x1.5mm with Cu Thickness 70um
| Material | Aluminum |
| Board Coating | Copper |
| Board Type | Single-Sided |
| Properties | Excellent Heat Dissipation |
| Application | High-Power Electronic Circuits |
This laminate for printed circuit boards, single-sided — Copper/AL, is used where quick and effective heat dissipation from the designed circuit is required. The laminate consists of three layers: Copper foil (35um or 70um), an insulating layer (thin epoxy of about 0.1mm), and an aluminum plate with a thickness of approximately 0.9mm or 1.4mm. The aluminum plate acts as a heat radiator. The laminate is protected on the aluminum side by adhesive foil resistant to etching processes. As a result, the process of manufacturing the printed circuit board is generally identical to the technology used for standard laminate PCB production. The protective foil is removed at the end of the process.
Copper Layer Thickness: 70 μm;